In recent years, the import amount of integrated circuits in China has accounted for a significant proportion of the total amount of imported goods in China. Under the new round of tariff war initiated by the Trump administration in the United States, both China and the United States have announced the imposition of tariffs on imported goods originating from the two countries to 125%. The US has a clear intention to promote the return of high-end semiconductor manufacturing to the US by raising tariffs and forcing TSMC to build factories in the US. Targeting the key link in the semiconductor industry in the China US trade war, the Chinese semiconductor industry released new regulations on April 11th. Through precise tariff leverage and supply chain restructuring, it may directly impact the cost structure and market share of American chips in the short term, and accelerate the process of China's semiconductor industry chain's self-reliance in the long term, weakening the technological and market advantages of the United States.

On April 11th, the China Semiconductor Industry Association issued an emergency notice stating that according to the relevant regulations of the General Administration of Customs, the origin of "integrated circuits" is determined based on the principle of changing the four digit tariff code, that is, the place of production is recognized as the origin. Regardless of whether it is packaged or not, the place of origin for import customs declaration shall be based on the location of the "wafer wafer assembly factory"

Chip fabrication "refers to the process in which chip design companies have small-scale manufacturing factories produce samples for comprehensive testing and evaluation in order to verify the feasibility of the design. If the design scheme is correct, then proceed to the large-scale manufacturing process. The chip's production site is the chip's production site.

Before the new regulations were introduced, American chip companies could avoid the tariffs imposed by China by shipping chips to third countries (such as Malaysia) for packaging and testing. After the new regulations are introduced, if the first four digits of the HS code are changed during the packaging process, even if subsequent packaging tests are completed in other regions, the packaging location will still be recognized as the place of origin. This essentially binds the "nationality" of integrated circuits to the manufacturing process, highlighting the geopolitical importance of wafer fabs in the semiconductor industry chain.

According to China's latest tariff policy towards the United States, chips produced in the United States will be subject to a 125% tariff. After the release of the new regulations, the top American chip manufacturers include Intel, Micron, Texas Instruments, and Adno Semiconductor. Among them, Texas Instruments and Yadno Semiconductor were the most affected because they have more wafer fabs in the United States; Intel wafer fabs are located in the United States, Ireland, and Israel, with relatively little impact. NVIDIA AMD、 Qualcomm and MediaTek are less affected. These enterprises are all located in Taiji Current Chip, which is identified as Taiwan, China, China according to the origin of the new chip. Importers do not need to consider tariff surcharge when purchasing.